CPIM

CPIM Lab

University of Nevada, Las Vegas

Research

CPIM investigates integrated technologies that connect circuits, communication, sensing, packaging, and computation—from transistor-level design through measurement and system demonstration.

Analog & Mixed-Signal Integrated Circuits

We develop energy-efficient analog and mixed-signal circuits for sensing, data conversion, communication, and intelligent edge systems.

  • Data converters and mixed-signal interfaces
  • Sensor readout and signal-conditioning circuits
  • Low-power analog and RF building blocks
  • Silicon implementation, testing, and characterization

Variation-Aware and Stochastic Data Converters

CPIM research explores data-converter architectures that use device mismatch statistically rather than treating it solely as an error source. Prior work demonstrated fully differential stochastic comparator arrays in 180-nm CMOS with an effective LSB of approximately 0.22–0.25 mV, followed by a sub-ranging stochastic ADC employing a flash coarse stage and LUT linearization to extend input range and improve ENOB.

Variation-aware stochastic data converters showing a calibration-free comparator array, measured effective resolution, sub-ranging architecture, and LUT-linearized ENOB results
Variation-aware stochastic data conversion in 180-nm CMOS: calibration-free fine-resolution comparator arrays and sub-ranging ADC architectures with LUT linearization.

RF, mm-Wave, and THz ICs & Antennas

Our research explores high-frequency integrated circuits and antennas for communication, sensing, imaging, and chip-to-chip connectivity.

  • RF/mm-wave/THz transmitters, receivers, and pulse transceivers
  • On-chip, on-package, and on-glass antennas and arrays
  • Near-field and far-field antenna characterization
  • High-frequency measurement techniques and test structures

Advanced Packaging & Heterogeneous Integration

We study communication and co-design techniques that integrate multiple chips, packages, antennas, and technologies into scalable systems.

  • Chiplet-to-chiplet communication
  • Package-aware circuit and electromagnetic co-design
  • Heterogeneous integration and high-speed interconnects
  • Glass-based antennas and passive structures

Intelligent Microsystems

We combine custom hardware, embedded systems, and data-driven methods to create intelligent sensing platforms for real-world applications.

  • Multimodal biomedical and environmental sensing
  • Embedded systems and FPGA-based prototyping
  • Edge AI and hardware-aware signal processing
  • Connected sensors for health, agriculture, and infrastructure

Our Research Approach

DESIGN · BUILD · MEASURE

CPIM students connect theory with implementation through circuit design, electromagnetic simulation, fabrication, measurement, system integration, and technical communication. Our projects are structured toward tangible outcomes: paper · chip · prototype.