Projects – CPIM Lab

CPIM projects translate integrated-circuit innovation into antennas, packaging, measurement platforms, embedded intelligence, and real-world applications.

Current CPIM Initiatives

Chiplet-to-Chiplet Communication

We are investigating mm-wave and sub-THz wireless links for high-data-rate communication between chiplets and computing modules. The research combines CMOS transceivers, antennas, package-aware electromagnetic design, and heterogeneous integration.

On-Glass Antennas and Integrated Packaging

This initiative explores antennas, arrays, and passive structures implemented on glass and other packaging substrates. The objective is to enable compact high-frequency interfaces with improved radiation performance and direct integration with CMOS chiplets.

Intelligent Multimodal Sensing

CPIM combines acoustic, chemical, RF, and environmental sensors with embedded systems and edge intelligence. Applications include aquaculture, food safety, biomedical monitoring, and resilient environmental sensing.

Selected Established Research

CMOS Pulse Transceivers with Integrated Antennas

Broadband pulse transmitters, receivers, and antenna arrays were integrated in CMOS and SiGe technologies for millimeter-wave sensing and active imaging. The work included on-chip pulse-delay calibration, beam-formability, leakage cancellation, and antenna–circuit co-design.

A 12–15 GHz pulse transceiver fabricated in 180-nm CMOS, showing integrated transmitter and receiver antennas, the measurement setup, and leakage-cancellation architecture — A 12–15 GHz pulse transceiver with integrated antennas and leakage cancellation, fabricated in 180-nm CMOS.

140-GHz CMOS Circuits

Research at 140 GHz demonstrated energy-efficient oscillators, modulators, and receiver architectures in 65-nm CMOS, establishing a technical foundation for emerging sub-THz communication and sensing systems.

On-Silicon and On-Glass Antennas

Integrated antenna research examined silicon and glass implementations for broadband millimeter-wave systems, including CMOS-on-glass pulse generators, antenna arrays, and near-field measurement structures.

A 90–130 GHz CMOS dipole-patch antenna system and a separate 15–20 GHz passive on-glass dipole antenna — CMOS and on-glass antenna research: a 90–130 GHz CMOS dipole-patch antenna system, on-glass pulse generator, and 15–20 GHz on-glass dipole.

Near-Field Magnetic Probes

High-sensitivity integrated magnetic probes were developed for non-invasive IC measurements, hardware-security analysis, power-network characterization, and localization of faults in semiconductor power devices.

mm-Wave and THz Food-Safety Sensing

Wide-frequency scanning from microwave through THz bands was investigated for non-invasive detection and classification of contaminants in agricultural and food products.

TIAS architecture and measured melamine response for non-invasive food-safety sensing from 77 GHz to 7 THz — TIAS food-safety sensing: a 77 GHz–7 THz system concept with measured melamine responses, including the absorption peak near 4 THz.

AIoT Aquaculture Systems

Multimodal platforms integrating water-quality sensors, acoustic monitoring, wireless connectivity, and data-driven analysis were developed to support resilient and intelligent aquaculture.

Emerging Directions

140-GHz and sub-THz links for chiplets and AI computing systems
CMOS, antenna, and package co-design for heterogeneous integration
On-chip and in-package sensing for system health and security
Edge-intelligent biomedical and environmental microsystems
Measurement methods for mm-wave and THz integrated technologies