The Circuits, Packaging, and Intelligent Microsystems (CPIM) Lab formally launched with its inaugural group meeting on September 1, 2026, in the Department of Electrical and Computer Engineering at the University of Nevada, Las Vegas.
CPIM brings together graduate, undergraduate, and pre-college researchers working across analog and mixed-signal integrated circuits, RF/mm-wave/THz technologies, advanced packaging and chiplets, antennas, embedded systems, and intelligent sensing.
Through a design–build–measure approach, the lab connects foundational research with integrated-circuit tape-outs, hardware prototypes, publications, and student professional development.