Circuits, Packaging, and Intelligent Microsystems

We develop integrated technologies that connect sensing, computation, communication, and the physical world—from transistor-level circuits to complete intelligent systems.

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RESEARCH AREAS

From devices to intelligent systems

Analog & Mixed-Signal ICs

Data converters, sensor interfaces, power-aware circuits, and silicon-proven mixed-signal building blocks.

RF/mm-Wave/THz

RFICs, pulse transceivers, on-chip and on-glass antennas, and measurement techniques for emerging frequency bands.

Advanced Packaging

Chiplets, heterogeneous integration, package-aware design, and high-speed chip-to-chip communication.

Intelligent Microsystems

Multimodal sensing, embedded and FPGA systems, edge AI, and biomedical and environmental applications.

SELECTED RESEARCH

Circuits, fields, and intelligent systems

CMOS dipole-patch antenna system and passive on-glass dipole antenna research — CMOS and on-glass antenna research

Integrated magnetic probe sensing for IC measurement, security, and IGBT fault localization — Magnetic probe sensing for IC measurement, security, and fault localization

TIAS system concept and measured melamine response for non-invasive food-safety sensing from 77 GHz to 7 THz — TIAS mm-wave and THz food-safety sensing

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PAPER · CHIP · PROTOTYPE

Research training with tangible outcomes

CPIM students learn by designing, building, measuring, documenting, and communicating. Projects connect fundamentals with publications, silicon, hardware prototypes, and professional growth.

Meet the team

Build the next generation of intelligent hardware

We welcome motivated students interested in integrated circuits, electromagnetics, packaging, embedded systems, and sensing.

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